Tungsten Carbide Substrates of Polycrystalline Diamond Cutter
We manufacture highly engineered cemented carbide substrates for polycrystalline diamond (PDC) enhanced cutters.
Tungsten carbide(WC) substrate is one of the optimum foundations for mining or machining tool parts coated by a layer of diamond film. We utilize fine or ultra-fine WC powder in fabricating the WC substrate in order to improve the stress distribution and enhance a more nature connectivity degree between TC substrate and PDC skin layer.
The advanced computer-controlled HIP furnaces are applied to provide more pressure during the sintering process in order to get denser structure.
We carefully select and control the excellent quality of our raw powders. Powder spray drying technology ensures the uniformity of distribution of particles.
We offer customers a wide array of processing services on-site including centerless grinding, CNC cylindrical grinding, CNC internal grinding, wire EDM, and laser etching, etc.